EDI CON 2019 – Electronic Design Innovation Conference
EDI CON China brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come from communication, defense, consumer electronics, aerospace, and medical industries. Welcome to Premix's booth to see our ultra-low loss, dielectric PREPERM® plastic material solutions for mmWave applications.
EDI CON 2019
01.04.2019 - 03.04.2019
China National Conference Center, Beijing
Premix staff at the event: