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EDI CON 2019 – Electronic Design Innovation Conference

EDI CON China brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come from communication, defense, consumer electronics, aerospace, and medical industries. Welcome to Premix's booth to see our ultra-low loss, dielectric PREPERM® plastic material solutions for mmWave applications.

EDI CON 2019

01.04.2019 - 03.04.2019

China National Conference Center, Beijing

Premix staff at the event:
Xisheng Cong

Premix booth:
To be announced later

Beijing

Meet us

Xisheng Cong

Business Manager, B.Sc (electronic material), M.Sc (optical fiber communication), MBA (project management and marketing)

I have a long working experience in a global telecommunications company. Understanding cultural differences is one of my strengths.  I am constantly searching for new business opportunities for high frequency material  and always willing to take up new challenges. My passion is to develop the optimal solution together with the customers – which makes them happy and satisfied!